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| Dear Valued Customer, Products manufactured by Electropac Co., Inc. without a tin/lead solder finish are RoHS compliant. Electropac Co., Inc. does not intentionally add substances that exceed acceptable limits prohibited by the RoHS (2002/95/EWG) directive. As a result of RoHS, assemblers shall be required to assemble boards without leaded solders. This introduces lead-free solder alloys that require higher soldering temperatures at extended periods of time. Traditional FR4 laminates are not capable of withstanding the higher temperatures (235°C to 270°C) and time at temperature (60 to 90 seconds) required by lead-free solder alloys. Electropac Co. shall provide recommendations on materials and final finishes for lead free applications upon request. Electropac Co., Inc. recognizes the need by some customers to assemble boards with eutectic solders consisting of tin and lead. Electropac Co., Inc. shall provide tin/lead solder on printed circuit boards per specifications as defined by the purchaser of said printed circuit boards. Printed circuit boards coated with a tin/lead finish shall not be RoHS compliant. Regards, David Duross dduross@electropac.com Technical Service Engineer |
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