Dear Valued Customer,

Products manufactured by Electropac Co., Inc. without a tin/lead solder finish are RoHS
compliant. Electropac Co., Inc. does not intentionally add substances that exceed
acceptable limits prohibited by the RoHS (2002/95/EWG) directive. As a result of RoHS, assemblers shall be required to assemble boards without leaded solders. This introduces
lead-free solder alloys that require higher soldering temperatures at extended periods
of time. Traditional FR4 laminates are not capable of withstanding the higher temperatures
(235°C to 270°C) and time at temperature (60 to 90 seconds) required by lead-free solder
alloys. Electropac Co. shall provide recommendations on materials and final finishes for
lead free applications upon request.

Electropac Co., Inc. recognizes the need by some customers to assemble boards with
eutectic solders consisting of tin and lead. Electropac Co., Inc. shall provide tin/lead
solder on printed circuit boards per specifications as defined by the purchaser of said
printed circuit boards. Printed circuit boards coated with a tin/lead finish shall not
be RoHS compliant.

Regards,
David Duross
Quality Assurance / Engineering
dduross@electropac.com