 |
|||
 |
|||
 |
|||
 |
|||
 |
|||
 |
|||
 |
|||
 |
|||
 |
|||
 |
|||||
| Alternate Final Finishes • Types: ENIG, Immersion Silver, Entek HT • Minimum Panel Size: 5" x 5" • Maximum Panel Size: 21" x 24" • Minimum Panel Thickness: .015" • Maximum Panel Thickness: .250" • Finish Thickness Ranges: ENIG 120 to 240 microinches Electroless Nickel and 2 to 4 microinches Immersion Gold per IPC-4552. • Immersion silver: Solderable surface only. Typical thickness ranges from 5 to 12 microinches per IPC-4553. • ENTEK HT: Solderable surface with visual acceptance criteria only. Dry Film Solder Mask • Type: Dupont Vacrel 8100 • Minimum Panel Size: 5" x 5" • Maximum Panel Size: 18" x 24" • Minimum Panel Thickness: .020" • Maximum Panel Thickness: .125" • Dry Film Mask Thickness: 4 mils • Specification: Meets IPC-SM-840 Class III requirements. • Special Capabilities: Uniform thickness and superior via tenting capabilities. Liquid Photo Imageable Solder Mask • Type: Lackwerke Peters ELPEMER AS 2467 XM-XG • Minimum Panel Size: 9" x 9" • Maximum Panel Size: 21" x 24" • Minimum Panel Thickness: .015" • Maximum Panel Thickness: .125" • Mask Thickness: .8 mils to 1.2 mils • Color: Extra Matte / Extra Dark-Green • Specifications: Meets IPC-SM-840 Class III and Belcore GR-78-CORE. • Special Capabilities: Very good resistance to galvanic and electroless nickel/gold, palladium, tin baths, and OSP processes. |
Scoring • Unit: AS-150 • Minimum Panel Size: 5" x 5" • Maximum Panel Size: 25" x 25" • Minimum Panel Thickness: .020" • Maximum Panel Thickness: .125" • Unit Positioning Accuracy: +/-.001" • Residual Web Thickness: Fully adjustable down to .005" • Panel Support: 2 corner clamps pinning with .126" diameter tooling holes and Urethane coated guide wheels. • Closest score line to tooling hole: .250" minimum • Score Webs: 30, 45, and 60 degrees . (30 degrees is standard) • Special Capabilities: Jump scoring and top to bottom blade off-set. Horizontal Hot Air Solder Leveling • Unit: Teledyne Halco WSL 175 • Solder: Eutectic Sn63-Pb37 Solder • Minimum Panel Size: 5" x 5" • Maximum Panel Size: 21" x 24" • Minimum Panel Thickness: .015" • Maximum Panel Thickness: .250" • Capabilities: 20 mil pitch or greater a thickness range of 80 to 800 microinches with a 250 to 500 microinches deviation. • Specifications: Meets IPC-6012 and IPC-J-STD-003 • On less than 20 mil pitch a thickness range of 100 to 1500 microinches with a 400 to 600 microinches deviation. • On BGAs a thickness range of 80 to 800 microinches with a 200 to 400 microinches deviation. • On small chip sites .060" x .060" thickness range 100 and 600 microinches is typical. • On plated through holes on panels less than .125" thick and with hole aspect ratio less than 8 to 1, a .001" to .002" hole size reduction from copper diameter is typical. A maximum hole size reduction of .003" from copper diameter may be expected. • Panels over .125" thick need to be evaluated. |
||||
|
|
