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Electropac

A worldwide high-performance
printed circuit board manufacturer
 
   
 
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SERVICES

Alternate Final Finishes
• Types: ENIG, Immersion Silver, Entek HT
• Minimum Panel Size: 5" x 5"
• Maximum Panel Size: 18" x 24"
• Minimum Panel Thickness: .015"*
u*Special - .005" with leaders or wires.
• Maximum Panel Thickness: .250"
• Finish Thickness Ranges:
uENIG 120 to 240 microinches Electroless Nickel and
u2 to 4 microinches Immersion Gold per IPC-4552.
• Immersion silver: Solderable surface only.
uTypical thickness ranges from 5 to 12 microinches
uper IPC-4553.
• ENTEK HT: Solderable surface with visual acceptance
ucriteria only.

Dry Film Solder Mask
• Type: Dupont Vacrel 8100
• Minimum Panel Size: 5" x 5"
• Maximum Panel Size: 18" x 24"
• Minimum Panel Thickness: .020"*
u*Special - .005" with leaders or wires. 2x film usage.
• Maximum Panel Thickness: .125"
• Dry Film Mask Thickness: 4 mils
• Specification: Meets IPC-SM-840 Class III requirements.
• Special Capabilities: Uniform thickness and
usuperior via tenting capabilities.

Liquid Photo Imageable Solder Mask
• Type: Electra EMP110 on Grace Electrostatic
uTaiyo PSR-4000 on DP1500
• Minimum Panel Size: 9" x 9"
• Maximum Panel Size: 21" x 24"
• Minimum Panel Thickness: .015"
• Maximum Panel Thickness: .125"
• Mask Thickness: .8 mils to 1.2 mils
• Color: Extra Matte / Extra Dark-Green
• Specifications: Meets IPC-SM-840 Class III and Belcore
uGR-78-CORE.
• Special Capabilities: Very good resistance to galvanic and
uelectroless nickel/gold, palladium, tin baths, and OSP
uprocesses.

 



Scoring
• Unit: AS-150
• Minimum Panel Size: 5" x 5"
• Maximum Panel Size: 25" x 25"
• Minimum Panel Thickness: .020"
• Maximum Panel Thickness: .125"
• Positioning Accuracy: +/-.005"
• Residual Web Thickness: Fully adjustable down to .006"
• Panel Support:
u2 corner clamps pinning with .126" diameter
utooling holes and Urethane coated guide wheels.
• Closest score line to tooling hole: .250" minimum
• Closest hole to panel edge: .500" minimum
• Score Webs: 30, 45, and 60 degrees .
u(30 degrees is standard)
• Special Capabilities: Jump scoring and top to
ubottom blade off-set.

Horizontal Hot Air Solder Leveling
• Unit: Teledyne Halco WSL 175
• Solder: Eutectic Sn63-Pb37 Solder
• Minimum Panel Size: 5" x 5"
• Maximum Panel Size: 21" x 24"
• Minimum Panel Thickness: .015"*
u*Special - Thin Flex at .005" thickness.
• Maximum Panel Thickness: .250"
• Capabilities: 20 mil pitch or greater a thickness
urange of 80 to 800 microinches with a 250 to 500
umicroinches deviation.
• Specifications: Meets IPC-6012 and IPC-J-STD-003
• On less than 20 mil pitch a thickness range of 100 to
u1500 microinches with a 400 to 600 microinches deviation.
• On BGAs a thickness range of 80 to 800 microinches
uwith a 200 to 400 microinches deviation.
• On small chip sites .060" x .060" thickness range
u100 and 600 microinches is typical.
• On plated through holes on panels less than .125"
uthick and with hole aspect ratio less than 8 to 1,
ua .001" to .002" hole size reduction from copper
udiameter is typical. A maximum hole size reduction
uof .003" from copper diameter may be expected.
• Panels over .125" thick need to be evaluated.


252 Willow Street
 
  ISO 9000:2001   IPC Member   UL Listed  
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