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values that distinguish Electropac
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EQUIPMENT LIST



 
   
 
   
 
 
TECHNOLOGY
STANDARD
ADVANCED
Product Type
Rigid • Flex • Rigid-Flex
Maximum Panel Size
18" x 24"
21" x 24"
Maximum Board Size
16.5" x 22.5"
19.5" x 22.5"
Maximum Layers
16
24 - 30
Maximum Board Thickness
.125
.200 - .250
Minimum Core Thickness
.004
.002 - .001
Maximum Copper Weight
3 oz.
4 oz. - 8 oz.
Minimum Line Width / Spacing
.005 / .005
.003 / .003
Smallest Drilled Hole
.010
.008 - .004
Hole Aspect Ratio
6:1
8:1 - 10:1
Vias
Blind/Buried • Via in Pad • Metal/Epoxy Filled
Materials
FR4 Tetrafunctional (140 Tg) • Multifunctional (170 Tg) • Lead-Free (180 Tg) • Ventec
High-Performance FR408 • Polyimide
Getek • Nelco-13 • Teflon
 
Finishes
ENIG Electroless Nickel/Immersion Gold
OSP Entek HT • Immersion Silver
Electrolytic Nickel / Gold
Horizontal Lead-Free HASL

 

 

     

         
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