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Our commitment and integrity are
values that distinguish Electropac
with those we serve. |
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TECHNOLOGY |
STANDARD |
ADVANCED |
Product Type |
Rigid • Flex • Rigid-Flex |
Maximum Panel Size |
18" x 24"
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21" x 24"
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Maximum Board Size |
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19.5" x 22.5"
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Maximum Layers |
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24 - 30
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Maximum Board Thickness |
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.200 - .250
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Minimum Core Thickness |
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.002 - .001
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Maximum Copper Weight |
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4 oz. - 8 oz.
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Minimum Line Width / Spacing |
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.003 / .003
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Smallest Drilled Hole |
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.008 - .004
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Hole Aspect Ratio |
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8:1 - 10:1
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Vias |
Blind/Buried • Via in Pad • Metal/Epoxy Filled
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Materials |
FR4 Tetrafunctional (140 Tg) • Multifunctional (170 Tg) • Lead-Free (180 Tg) • Ventec
High-Performance FR408 • Polyimide
Getek • Nelco-13 • Teflon
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Finishes |
ENIG Electroless Nickel/Immersion Gold
OSP Entek HT • Immersion Silver
Electrolytic Nickel / Gold
Horizontal Lead-Free HASL
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© 2010 Electropac Co., Inc.
® Logos, trademarks and/or registered trademarks
used above are properties of their respective owners. |
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Website designed and maintained by Republic Brand Company |
