|
|
|
|
|
|
 |
|
|
|
Current
|
Future
|
|
Stand. Production
|
Adv. Production
|
Stand. Production
|
Adv. Production
|
| Maximum Layers |
16
|
24
|
24
|
28+
|
| Max. Board Thickness |
.125
|
.200
|
.200
|
.250+
|
| Max. Copper Weight |
3 ounces
|
4 ounces
|
4 ounces
|
5 ounces
|
| Max. Board Size |
16.5" x 22.5"
|
19.5" x 22.5"
|
19.5" x 22.5"
|
22.5" x 25.5"
|
| Smallest Drilled Hole |
.010
|
.008
|
.008
|
.006
|
| Max. Panel Size |
18" x 24"
|
21" x 24"
|
21" x 24"
|
24" x 27"
|
Min. Line Width
and Spacing
|
.005/.005
|
.004/.004
|
.004/.004
|
.003/.003
|
|
| Min. Core Thickness |
.004
|
.002
|
.002
|
.002
|
| Hole Aspect Ratio |
6:1
|
8:1
|
8:1
|
10:1
|
| Vias |
Blind/Buried
|
Blind/Buried
|
Blind/Buried
|
Blind/Buried
|
| Materials |
FR4 Tetrafunctional (IS402)
Multifunctioanl (FR406)
Isola FR408, Isola IS410
Isola FR370 HR
|
Getek
Rogers 4000 Series
Rogers 5880
Nelco N4000-13, Polyimide
|
Getek, Rogers 4000 Series
FR408, Polymide
|
Ceramic, Teflon
|
|
|
| Finishes |
Electroless Nickel/Immersion Gold (ENIG), Entek HT
Immersion Silver, Immersion Tin, Electrolytic Nickel
Hard Gold, Soft Gold, Hot Air Level Solder
|
Palladium, ENIPdG
CasTin, SAC305
|
|
|
|
